BUMP SERIES

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  Production Overview

        TFME is able to provide Solder bump, Cu pillar bump and Gold bump for customer to meet different requirement.



Feature


Solder bump

- Wafer size: 8 inch / 12 inch

- Bump qty: 2892(MAX)

- Structure: 0P1M~2P2M   

- Body size:  0.7*0.76~10.7*10.7 mm 

- RDL L/S: min.5um/5um 

Cu pillar bump  

- Wafer size: 8 inch / 12 inch   

- Bump qty:  1500 pin (max) 

- Structure: 0P1M~1P2M

- Body size:  1.0*1.5~10*10mm

- RDL  L/S: min. 5um/5um

Gold bump

- Wafer size: 8 inch / 12 inch

- Bump qty: 4091/pin (max)

- Structure: 0P1M~1P1M

- Structure: 0P1M~1P1M 

- Bump L/S: min.10um/8um 



Process Capability & Design Rule

Solder bump & Cu pillar

 


Process Capability & Design Rule

Gold bump



Reliability Test Standards

Solder bump & Cu Pillar bump

Gold bump


Shipment Packing




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